Process development

Process development covers all areas related to the development of layers and application techniques.

In the classical sense, layer development is concerned with the development of materials. These are needed in order to meet ever-rising product and component requirements. Electroplating can be used in a number of ways. On the one hand, it can be implemented to further develop and modify typical plating metals, such as chrome, nickel, copper and zinc. It also enables new layer materials or layer combinations to be applied using modern processes such as dispersion deposition and alloy deposition.

Due to a lack of appropriate techniques, up till now it has been impossible to apply some metals or metal compounds. Process development aims at providing new technologies for their deposition as well as continuously improving existing processes.

We develop specific layer materials to meet requirements and supply the processes you need to apply them in your production facility.

Conventional metal deposition

Copper, nickel, chrome and zinc are typical examples of metals used in electroplating. We develop state-of-the-art processes to adapt these materials even better to requirements.

Alloy deposition

Alloy layers open up numerous possibilities as far as layer properties are concerned. Alloys from two or even more different metals can be designed with electroplating processes.

Dispersion deposition

Dispersion deposition is used to incorporate solid matter particles into metal layers. This gives the resulting layer structure specific attributes, such as lubrication properties, corrosion protection or protection against wear.

Anodization deposition

The use of anodization to refine surfaces with aluminium offers numerous advantages. Pulse anodization makes hard-anodized layers extremely energy-efficient.